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Si/(Ni-Cr合金)/Cu擴散偶950℃相穩定性

Phase stability of Si/(Cr-Ni alloy)/Cu couples at 950 ℃

  • 摘要: 在半導體硅片(Si)-擴散阻擋層(Ni-Cr合金)-金屬互連材料(Cu)構成的體系中,Si和Ni-Cr合金之間以及Ni-Cr合金和Cu之間各構成一對擴散偶.通過制備擴散偶試樣模擬相應的界面反應,實驗測定950℃下界面反應產物的表觀序列.從熱力學的角度,分別對Cr-Ni-Si和Cr-Cu-Ni三元系中Si/(Ni-Cr)和(Ni-Cr)/Cu兩個界面進行反應驅動力分析.計算獲得的階段性生成相表觀序列與實驗測得結果一致.

     

    Abstract: In a system consisted of semiconductor silicon wafer (Si), diffusion resistant layer (Cr-Ni alloy) and metal contact material (Cu), diffusion couples were formed at Si/(Cr-Ni) and (Cr-Ni)/Cu, respectively. The phases formed due to interracial reactions in both the diffusion couples were investigated experimentally and the apparent phase contact sequences were obtained at 950℃. Based on phase equilibrium calculations of the Cr-Cu-Ni and the Cr-Ni-Si ternary systems, the phase formation driving forces for interfacial reactions of the diffusion couples were analyzed theoretically. The step-by-step phase formation sequences were obtained to simulate microstructure evolutions in the diffusion couples. The thermodynamic predictions are in accord with the experimental observations.

     

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