Abstract: The texture of interconnecting aluminum films prepared by conventional and modified technology was examined using X-ray diffraction It is demonstrated, that the high volume fraction and high sharpness of the 111 fiber texture will drastically reduce the invalidation ratio of very large-scale integrated electronic circuits. The reasons of invalidation and the positive effects of the 111 fiber texture are discussed. It is pointed out, that attention should be paid to the corresponding texture problems in new interconnecting copper films.