聚二硫二丙烷磺酸鈉在二元絡合化學鍍銅體系中的作用

盧建紅; 焦漢東; 焦樹強

doi:10.13374/j.issn2095-9389.2017.09.011

聚二硫二丙烷磺酸鈉在二元絡合化學鍍銅體系中的作用

doi: 10.13374/j.issn2095-9389.2017.09.011

北京科技大學鋼鐵冶金新技術國家重點實驗室, 北京 100083

詳細信息

中圖分類號: TQ153.1
計量
- 文章訪問數: 1112
- HTML全文瀏覽量: 272
- PDF下載量: 29
- 被引次數: 0
出版歷程
- 收稿日期: 2016-12-01

Effect of sodium 3,3'-dithiodipropane sulfonate in a dual-ligand electroless copper system

State Key Laboratory of Advanced Metallurgy, University of Science and Technology Beijing, Beijing 100083, China

摘要

摘要: 用電化學方法研究添加劑聚二硫二丙烷磺酸鈉(SPS)對乙二胺四乙酸(EDTA)/四羥丙基乙二胺(THPED)二元絡合化學鍍銅過程的影響,測量體系的混合電位-時間關系,加入SPS后混合電位負移,負移過程較平緩,無突躍現象;采用線性掃描伏安法研究體系,表明SPS促進了陰陽兩極的極化,但主要是影響甲醛氧化的陽極極化過程.SPS也因此一定程度上提高了過程的沉積速率.通過掃描電鏡、能譜儀和X射線衍射儀對結構的分析,鍍層銅純凈度較高,無氧化銅等夾雜,鍍層細致平滑,發現SPS有促進(200)晶面擇優取向的作用.
- 聚二硫二丙烷磺酸鈉 /
- 化學鍍銅 /
- 絡合劑 /
- 混合電位 /
- 線性掃描伏安法 /
- 晶面擇優取向
Abstract: The process of electroless copper plating in an EDTA/THPED dual-ligand system using sodium 3,3'-dithiodipropane sulfonate (SPS) as an additive was studied by the electrochemical method. The mixed potential of the system was measured as a function of time, and results indicate that addition of SPS gradually shifts the mixed potential toward the negative direction without saltation. The dual-ligand electroless copper system was then tested by linear sweep voltammetry, and SPS is found to accelerate both cathodic and anodic polarization. The additive mainly influences the anodic polarization of the formaldehyde oxidation process and the rate of copper deposition is improved to a certain extent. The surface morphology and texture of the resulting plated copper were also analyzed by scanning electron microscope, energy dispersive spectrometer and X-ray diffraction, and a high-purity product without Cu₂O inclusions is confirmed. Moreover, the X-ray diffraction results of the electroless copper layers show that addition of SPS favors the formation of the preferred orientation on the (200) lattice plane.
- sodium 3,3'-dithiodipropane sulfonate /
- electroless copper /
- ligand /
- mixed potential /
- liner sweep voltammetry /
- preferred orientation

HTML全文

參考文獻(17)

[1]	Narcus H. Practical copper reduction on nonconductor. Metal Finish, 1947, 45(2):964
[2]	Cahill A E. Surface catalyzed reduction of copper. Am Electrochem Soc Proc, 1957, 44:130
[7]	Shingubara S, Wang Z L, Yaegashi O, et al. Bottom-up fill of copper in deep submicrometer holes by electroless plating. Electrochem Solid-State Lett, 2004, 7(6):C78
[8]	Miura S, Honma H. Advancecd copper electroplating for application of electronics. Surf Coat Technol, 2003, 169-170:91
[9]	Kobayashi T, Kawasaki J, Mihara K, et al. Via-filling using electroplating for build-up PCBs. Electrochim Acta, 2001, 47(1-2):85
[11]	Norkus E, Vaškelis A, Jačiauskienė J, et al. Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths:application of xylitol, D-mannitol and D-sorbitol as copper (Ⅱ) ligands. J Appl Electrochem, 2005, 35(1):41
[12]	Mishra K G, Paramguru R K. Kinetics and mechanism of electroless copper deposition at moderate-to-high copper ion and lowto-moderate formaldehyde concentrations. Metall Mater Trans B, 1999, 30(2):223
[13]	Lee C H, Lee S C, Kim J J. Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropy1)-disulfide (SPS). Electrochim Acta, 2005, 50(16-17):3563
[14]	Paunovic M. Ligand effects in electroless copper deposition. J Electrochem Soc, 1977, 124(3):349
[15]	Norkus E, Kepenienė V, Vaškelis A, et al. Application of environmentally friendly ligands for alkaline electroless copper plating systems:electroless copper deposition using trisodium salt of 2-hydroxy-1, 2, 3-propanetricarboxylic acid as Cu (Ⅱ) ligand. Chemija, 2006, 17(4):20
[16]	Ramasubramanian M, Popov B N, White R E, et al. A mathematical model for electroless copper deposition on planar substrates. J Electrochem Soc, 1999, 146(1):111
[17]	Pauliukaité R, Stalnionis G, Jusys Z, et al. Effect of Cu (Ⅱ) ligands on electroless copper deposition rate in formaldehyde solutions:An EQCM study. J Appl Electrochem, 2006, 36(11):1261
[18]	Jusys Z, Pauliukaite R, Vaškelis A. EQCM study of the effect of ligands on the rate of CuⅡ reduction by formaldehyde. Phys Chem Chem Phys, 1999, 1:313
[19]	Vaškelis A, Jačiauskienė J, Stalnionienė I, et al. Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions. J Electroanal Chem, 2007, 600(1):6
[20]	Jusys Z, Stalnionis G, Juzeliūnas E, et al. The kinetic HD isotope effect in electroless copper plating. An EQCM study. Electrochim Acta, 1998, 43(3-4):301
[21]	Mishra K G, Paramguru R K. Surface modification with copper by electroless deposition technique:an overview. Afr J Pure Appl Chem, 2010, 4(6):87
[22]	Hu F T, Yang S, Wang H Z, et al. Electroless silver coating on copper microcones for low-temperature solid-state bonding. J Electron Mater, 2015, 44(11):4516