Mechanism of Electeodeposition of Cu/Ni Multilayer Thin Film
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摘要: 采用動電位掃描、循環伏安法以及交流阻抗等方法,研究了從檸檬酸鹽體系中電沉積銅鎳納米多層膜的電沉積機理。研究結果表明:在研究體系中銅的沉積是擴散控制的電極過程,而鎳的沉積則是首先形成類似Ni(OH)ads的吸附中間產物,而后在電極上進一步還原為原子態。Abstract: The mechanism of electrodeposition of Cu/Ni multilayer thin films from citrate salt electrolyte has been studied by means of potentodynamic sweep, cyclic voltammetry sweep and AC impendence.The results indicated that the copper deposition is mass transfer controlled process and nickel deposition is related to the absorbed intermediate species such as Ni(OH)ads. The nickel ions first form Ni(OH)ads,then was deoxygenated to nickel on the electrode surface.
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Key words:
- AC Impendence /
- electrodeposition /
- Cu/Ni alloy /
- multilayer film
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